TSMC provides the foundry segment's leading advanced process technologies and design collaterals. These include 55nm, 65nm, 90nm and 0.13-micron processes. TSMC's advanced 12-inch process technology provides the optimal combination of gate density, speed, and power, making it ideal for a broad range of applications such as computing, communications, and consumer electronics. Each node supports logic, and mixed-signal/RF options with an embedded DRAM option available for 65nm and 90nm. Design collaterals include TSMC internal macros and foundry's largest third-party IP library portfolios.
Much of TSMC's Open Innovation Platform® targets advanced technology deployment. It is collaborative model brings together the best technical thinking of partners and customers alike and has driven TSMC's reputation for ramping advanced technology processes at the leading edge of the adoption curve.
TSMC advanced technology is significantly ahead of the ITRS roadmap. The company delivers a new advanced technology generation every two years. Each node surpasses the previous one by close to half the area and usually features 30 to 50 percent more performance, while supporting similar leakage levels. TSMC provides substantial advanced technology capacity by ramping the same node at multiple 300mm GIGAFAB™ facilities each of which will produce over 100,000 12-inch wafers per month.
